| General information | |
|---|---|
| Launched | 2019 |
| Designed by | IBM |
| Performance | |
| Max. CPU clock rate | 5.2[1] GHz |
| Physical specifications | |
| Cores |
|
| Cache | |
| L1 cache | 128 KB instruction 128 KB data per core |
| L2 cache | 4 MB instruction 4 MB data per core |
| L3 cache | 256 MB shared |
| Architecture and classification | |
| Technology node | 14 nm[1] |
| Instruction set | z/Architecture |
| History | |
| Predecessor | z14 |
| Successor | Telum |
The z15 is a microprocessor made by IBM for their z15 mainframe computers, announced on September 12, 2019.[2]
Description
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The processor unit chip (PU chip) has 12 cores. The z15 cores support two-way simultaneous multithreading.[3]
The cores implement the CISC z/Architecture with a superscalar, out-of-order pipeline. New in z15 is an on-chip nest accelerator unit, shared by all cores, to accelerate compression.[3]
The cache (e.g. level 3) is doubled from the previous generation z14, while the "L4 cache increased from 672MB to 960MB, or +43%" with the new add-on chip system controller (SC) SCM. Both it and all levels of cache in the main processor from level 1 use eDRAM, instead of the traditionally used SRAM. "A five-CPC drawer system has 4800 MB (5 x 960 MB) of shared L4 cache."[citation needed]
References
edit- ^ a b c "IBM z15 (z15)". IBM. Archived from the original on 2020-04-20.
- ^ "IBM Unveils z15 With Industry-First Data Privacy Capabilities" (Press release). IBM. September 12, 2019. Archived from the original on 2020-01-01. Retrieved 2019-09-15.
- ^ a b IBM z15 (8561) Technical Guide (PDF). September 2019. SG24-8851-00. Retrieved September 14, 2019.
